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FLIR

FLIR Hadron 640R RGB/Thermal Camera Module 32° (14mm) 60Hz

Regular price $3,520.00 USD
Regular price Sale price $3,520.00 USD
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 Hadron™ 640R pairs a performance-leading 640x512 resolution radiometric Boson® thermal camera with a 64MP visible camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run time are mission critical. The Boson longwave infrared (LWIR) thermal camera provides the ability to see through total darkness, smoke, most fog, glare as well as take the temperature of every pixel in the scene. The 64MP visible camera imagery enables AI and machine learning for intelligent sensing applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640R reduces development cost and shortens time to market.

 

INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE
Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.

BUILT FOR INTEGRATORS
Reduce development cost and time to market with a solution from a single, reliable supplier.

OPTIMIZE DESIGN AND OPERATION TIME WITH COMPACT, LIGHTWEIGHT, AND LOW-POWER MODULE.
The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ MWIR camera portfolio.

 

 

SPECIFICATIONS

  • Thermal Imaging Detector
    • Boson 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI

 

RADIOMETRY

  • Temperature Accuracy
    • ±5°C less, over 0°C to 100°C range.

IMAGING & OPTICAL

  • EO Camera Optics
    • EFL 4.8 mm, 67° HFOV, F/# 1/2.3
  • EO Camera Sensor
    • 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
  • EO Camera Video
    • Full resolution @ 60 Hz
  • IMU
    • ICM20602, I2C or SPI (selectable)
  • IR Camera Optics
    • EFL 13.6mm, 32° HFOV, F/# 1.0
  • IR Camera Video
    • Full resolution @ 60Hz
  • Thermal Imaging Detector
    • Boson 640x512 pixels, 12mm pitch, USB 3.0, 2-lane MIPI

CONNECTIONS & COMMUNICATIONS

  • Software Drivers
    • NVIDIA Jetson Nano
    • Qualcomm Snapdragon rb5
    • Qualcomm Snapdragon 865

*Contact Teledyne FLIR for latest software drivers

ELECTRICAL

  • Electrical Interface
    • Hirose DF40C-50DP-0.4V (51)
  • Example of mating connector
    • DF40HC(2.5)-50DS-0.4V (51)
  • Power
    • 5V, typical power dissipation <1800 mW, Max <2900 mW

MECHANICAL

  • Mechanical Interface
    • Screw mount to back plate
  • Size (w/o lens)
    • 35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)
  • Weight
    • 56 g


ENVIRONMENTAL & APPROVALS

  • Environmental Sealing
    • IP54 (with the rear interfaces sealed)
  • Operational & Storage Temperature
    • -20°C to +60°C
  • Tested EMI Performance
  • FCC part 15 Class B

 

Resources

Datasheet

 

 

US Only